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  ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 fca47n60 / fca47n60_f109 n-channel mosfet march 2013 www.fairchildsemi.com 1 fca47n60 / fca47n60_f109 n-channel superfet ? mosfet 600 v, 47 a, 70 m features ? 650 v @ t j = 150c ?typ. r ds(on) = 58 m ? ultra low gate charge (typ. q g = 210 nc) ? low effective output capacitance (typ. c oss .eff = 420 pf) ? 100% avalanche tested description superfet ? mosfet is fairchild semiconductor ? ?s first gener - ation of high voltage super-junction (sj ) mosfet family that is utilizing charge balance te chnology for outstanding low on- resistance and lower gate charge performance. this technology is tailored to minimize conducti on loss, provide superior switch - ing performance, dv/dt rate and higher avalanche energy. con - sequently, superfet mosfet is ve ry suit able for the switching power applications such as pfc, server/telecom power, fpd tv power, atx power and industrial power applications. d g s g s d to-3pn absolute maximum ratings symbol parameter fca47n60 fca47n60_f109 unit v dss drain-source voltage 600 v i d drain current - continuous (t c = 25 c) - continuous (t c = 100 c) 47 29.7 a a i dm drain current - pulsed (note 1) 141 a v gss gate-source voltage 30 v e as single pulsed avalanche energy (note 2) 1800 mj i ar avalanche current (note 1) 47 a e ar repetitive avalanche energy (note 1) 41.7 mj dv/dt peak diode recovery dv/dt (note 3) 4.5 v/ns p d power dissipation (t c = 25 c) - derate above 25 c 417 3.33 w w/ c t j, t stg operating and storage temperature range -55 to +150 c t l maximum lead temperature for soldering purpose, 1/8? from case for 5 seconds 300 c thermal characteristics symbol parameter typ. max. unit r jc thermal resistance, junction-to-case -- 0.3 c/w r cs thermal resistance, case-to-sink 0.24 -- r ja thermal resistance, junction-to-ambient -- 41.7 c/w
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 2 package marking and ordering information device marking device package reel size tape width quantity fca47n60 fca47n60 to-3p - - 30 fca47n60 fca47n60_f109 to-3pn - - 30 electrical characteristics t c = 25c unless otherwise noted symbol parameter conditions min typ max unit off characteristics bv dss drain-source breakdown voltage v gs = 0 v, i d = 250 a, t j = 25 c 600 -- -- v v gs = 0 v, i d = 250 a, t j = 150 c -- 650 -- v bv dss / t j breakdown voltage temperature coefficient i d = 250 a, referenced to 25 c -- 0.6 -- v/ c bv ds drain-source avalanche breakdown voltage v gs = 0 v, i d = 47 a -- 700 -- v i dss zero gate voltage drain current v ds = 600 v, v gs = 0 v v ds = 480 v, t c = 125 c -- -- -- -- 1 10 a a i gssf gate-body leakage current, forward v gs = 30 v, v ds = 0 v -- -- 100 na i gssr gate-body leakage current, reverse v gs = -30 v, v ds = 0 v -- -- -100 na on characteristics v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 3.0 -- 5.0 v r ds(on) static drain-source on-resistance v gs = 10 v, i d = 23.5 a -- 0.058 0.07 g fs forward transconductance v ds = 40 v, i d = 23.5 a (note 4) -- 40 -- s dynamic characteristics c iss input capacitance v ds = 25 v, v gs = 0 v, f = 1.0 mhz -- 5900 8000 pf c oss output capacitance -- 3200 4200 pf c rss reverse transfer capacitance -- 250 -- pf c oss output capacitance v ds = 480 v, v gs = 0 v, f = 1.0 mhz -- 160 -- pf c oss eff. effective output capacitance v ds = 0 v to 400 v, v gs = 0 v -- 420 -- pf switching characteristics t d(on) turn-on delay time v dd = 300 v, i d = 47 a r g = 25 (note 4, 5) -- 185 430 ns t r turn-on rise time -- 210 450 ns t d(off) turn-off delay time -- 520 1100 ns t f turn-off fall time -- 75 160 ns q g total gate charge v ds = 480 v, i d = 47 a v gs = 10 v (note 4, 5) -- 210 270 nc q gs gate-source charge -- 38 -- nc q gd gate-drain charge -- 110 -- nc drain-source diode characteristics and maximum ratings i s maximum continuous drain-source diode forward current -- -- 47 a i sm maximum pulsed drain-source diode forward current -- -- 141 a v sd drain-source diode forward voltage v gs = 0 v, i s = 47 a -- -- 1.4 v t rr reverse recovery time v gs = 0 v, i s = 47 a di f /dt =100 a/ s (note 4) -- 590 -- ns q rr reverse recovery charge -- 25 -- c notes: 1. repetitive rating: pulse width limit e d by maximum junction temperature 2. i as = 18 a, v dd = 50 v, r g = 25 , starting t j = 25 c 3. i sd 47 a, di/dt 200 a/ s, v dd bv dss , starting t j = 25 c 4. pulse test: pulse width 30 0 s, duty cycle 2% 5. essentially independent of operating temperature typical characteristics
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 3 typical performance characteristics figure 1. on-region characteristics figure 2. transfer characteristics 10 -1 10 0 10 1 10 0 10 1 10 2 v gs top : 15.0 v 10.0 v 8.0 v 7.0 v 6.5 v 6.0 v bottom : 5.5 v notes : 1. 250 s pulse test 2. t c = 25 i d , drain current [a] v ds , drain-source voltage [v] 24681 0 10 0 10 1 10 2 note 1. v ds = 40v 2. 250 s pulse test -55 150 25 i d , drain current [a] v gs , gate-source voltage [v] figure 3. on-resistance variation vs. figure 4. body diode forward voltage drain current and gate voltage v ariati on vs. s ource current and temperatue 0 20 40 60 80 100 120 140 160 180 200 0.00 0.05 0.10 0.15 0.20 v gs = 20v v gs = 10v note : t j = 25 r ds(on) [ ? ],drain-source on-resistance i d , drain current [a] 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 10 0 10 1 10 2 25 150 notes : 1. v gs = 0v 2. 250 s pulse test i dr , reverse drain current [a] v sd , source-drain voltage [v] figure 5. capacitance characteristics figure 6. gate charge characteristics 10 -1 10 0 10 1 0 5000 10000 15000 20000 25000 30000 c iss = c gs + c gd (c ds = shorted) c oss = c ds + c gd c rss = c gd notes : 1. v gs = 0 v 2. f = 1 mhz c rss c oss c iss capacitance [pf] v ds , drain-source voltage [v] 0 50 100 150 200 250 0 2 4 6 8 10 12 v ds = 250v v ds = 100v v ds = 400v note : i d = 47a v gs , gate-source voltage [v] q g , total gate charge [nc]
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 4 typical performance characteristics (continued) figure 7. breakdown voltage variation figure 8. on-resistance variation vs. temperature vs. temperature -100 -50 0 50 100 150 200 0.8 0.9 1.0 1.1 1.2 notes : 1. v gs = 0 v 2. i d = 250 a bv dss , (normalized) drain-source breakdown voltage t j , junction temperature [ o c] -100 -50 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 notes : 1. v gs = 10 v 2. i d = 47 a r ds(on) , (normalized) drain-source on-resistance t j , junction temperature [ o c] figure 9. safe operating area figure 10. maximum drain current vs. case temperature 10 0 10 1 10 2 10 3 10 -2 10 -1 10 0 10 1 10 2 operation in this area is limited by r ds(on) dc 10 ms 1 ms 100 us notes : 1. t c = 25 o c 2. t j = 150 o c 3. single pulse i d , drain current [a] v ds , drain-source voltage [v] 25 50 75 100 125 150 0 10 20 30 40 50 i d , drain current [a] t c , case temperature [ ] figure 10. transient thermal response curve 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 -2 10 -1 notes : 1. z jc (t) = 0.3 /w max. 2. d uty f actor, d =t 1 /t 2 3. t jm - t c = p dm * z jc (t) single pulse d=0.5 0.02 0.2 0.05 0.1 0.01 z jc (t), thermal response t 1 , square w ave pulse duration [sec] t 1 p dm t 2
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 5 gate charge test circuit & waveform resistive switching test circuit & waveforms unclamped inductive switching test circuit & waveforms
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 6 peak diode recovery dv/dt test circuit & waveforms
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 7 mechanical dimensions (continued) to-3p dimensions in millimeters
fca47n60 / fca47n60_f109 n-channel mosfet ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 8 mechanical dimensions (continued) to-3pn dimensions in millimeters
trademarks the following includes registered and unregistered trademarks and service marks, owned by fairchild semiconductor and/or its gl obal subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *trademarks of system general corporation, used under license by fairchild semiconductor. disclaimer fairchild semiconductor reserves the right to make changes with out further notice to any products herein to improve reliability, function, or design. fairchild does not assume an y liability arising out of th e application or use of any product or circuit described herein; neither does it convey an y license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s wo rldwide terms and conditions , specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized fo r use as critical components in life support devices or systems without the express written approval of fa irchild semiconductor corporation. as used here in: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform w hen properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably ex pected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms 2cool? accupower? ax-cap ? * bitsic? build it now? coreplus? corepower? crossvolt ? ctl? current transfer logic? deuxpeed ? dual cool? ecospark ? efficentmax? esbc? fairchild ? fairchild semiconductor ? fact quiet series? fact ? fast ? fastvcore? fetbench? fps? f-pfs? frfet ? global power resource sm green bridge? green fps? green fps? e-series? g max ? gto? intellimax? isoplanar? marking small speakers sound louder and better? megabuck? microcoupler? microfet? micropak? micropak2? millerdrive? motionmax? mwsaver? optohit? optologic ? optoplanar ? powertrench ? powerxs? programmable active droop? qfet ? qs? quiet series? rapidconfigure? saving our world, 1mw/w/kw at a time? signalwise? smartmax? smart start? solutions for your success? spm ? stealth? superfet ? supersot?-3 supersot?-6 supersot?-8 supremos ? syncfet? sync-lock? ?* tinyboost? tinybuck? tinycalc? tinylogic ? tinyopto? tinypower? tinypwm? tinywire? transic ? trifault detect? truecurrent ? * serdes? uhc ? ultra frfet? unifet? vcx? visualmax? voltageplus? xs? ? ? datasheet identification product status definition advance information formative / in design datasheet contains the design specifications for product development. specifications may change in any manner without notice. preliminary first production datasheet contains preliminary data; supplementary data will be published at a later date. fairchild semiconductor reserves the ri ght to make changes at any time without notice to improve design. no identification needed full production datasheet contains final specifications. fair child semiconductor reserves the right to make changes at any time without notice to improve the design. obsolete not in production datasheet contains specifications on a product t hat is discontinued by fairchild semiconductor. the datasheet is for reference information only. anti-counterfeiting policy fairchild semiconductor corporation?s anti-counterfeiting policy. fairchild?s anti-counterfeiting policy is also stated on our external website, www.fairchildsemi.com, under sales support . counterfeiting of semiconductor parts is a growing problem in th e industry. all manufactures of semiconductor products are expe riencing counterfeiting of their parts. customers who inadvertently purchase counterfeit parts ex perience many problems such as loss of brand reputation, substa ndard performance, failed application, and increased cost of production and manufacturing dela ys. fairchild is taking strong measures to protect ourselve s and our customers from the proliferation of counterfeit parts. fairchild strongly encourages customers to purchase fairchild parts either directly from fa irchild or from authorized fairchild distributors who are listed by country on our web page cited above . products customers buy either from fairchild directly or fr om authorized fairchild distributors are genuine parts, have full traceability, meet fairchild?s quality standards for handing and storage and provide access to fairchild?s full range of up-to-date technical and product information. fairchild and our authorized distributors will stand behind all warranties and wi ll appropriately address and warranty issues that may arise. fairchild will not provide any warranty coverage or other assistance for parts bought from unau thorized sources. fairchild is committed to combat this global problem and encourage our customer s to do their part in stopping th is practice by buying direct or from authorized distributors. rev. i64 ? ?2008 fairchild semiconductor corporation fca47n60 fca47n60_f109 rev.c0 www.fairchildsemi.com 9 fca47n60 / fca47n60_f109 n-channel mosfet


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